Up to
13×9.4×9.4 inch | 330×240×240 mm
- Large build volume for bigger prints
- More options for designs
* The build volume of the E2 is not cuboid. For more details, please click here.
Produce 3D models and their inverse simultaneously, increasing productivity and reducing print time.
Use both extruders in synchronized printing, doubling production capabilities.
Confirms that the printing platform is level whenever preparing to print. ABL maintains the distance between the print nozzles and bed, creating a uniform build area.
Improves bed adhesion and print quality by allowing the extruder to adjust to even minor surface contour changes.
Guides users through a simple, video-assisted process for verifying that the E2 is geometrically aligned.
After completing the Offset Calibration Guide, the E2 can be used worry-free, with properly aligned extruders.
Up to
* The build volume of the E2 is not cuboid. For more details, please click here.
Opening a door is detected automatically, immediately pausing the print and keeping users safe.
Turn off the RaiseTouch and LED lights to save energy and print throughout the night.
Easily remove prints from the flexible build plate while minimizing potential print damage to quickly return to printing.
NXP ARM Cortex-A9 Quad 1GHz Controller
PLA / ABS / HIPS / PC / TPU / TPE / NYLON / PETG / ASA / PP / PVA / Glass Fiber Infused / Carbon Fiber Infused / Metal Fill / Wood Fill
Visual Interface / Rapid Reviewing / Visual Print Progress / Full Adjustment Control
No longer will sudden lapses in power ruin a print. Power loss recovery allows users to print worry-free.
Environmentally friendly.
Designed to silently remove nano-particles.
Build Volume* (W×D×H) :
Single Extruder Print:
13×9.4×9.4 inch / 330×240×240 mm
Dual Extruder Print:
11.6×9.4×9.4 inch / 295×240×240 mm
Machine Size (W×D×H)
23.9×23.5×18.3 inch / 607×596×465 mm
Print Technology
FFF
Print Head System
Independent Dual Extruders
Filament Diameter
1.75 mm
XYZ Step Size
0.78125, 0.78125, 0.078125 micron
Print Head Travel Speed
30 – 150 mm/s
Build Plate
Flexible Steel Plate with Buildtak
Max Build Plate Temperature
110 ℃
Heated Bed Material
Silicone
Build Plate Leveling
Mesh-leveling with Flatness Detection
Supported Materials
PLA / ABS / HIPS / PC / TPU / TPE / NYLON / PETG / ASA / PP / PVA / Glass Fiber Infused / Carbon Fiber Infused / Metal Fill / Wood Fill
Layer Height
0.02 – 0.25 mm
Nozzle Diameter
0.4 mm (Default), 0.2/ 0.6/ 0.8/ 1.0 mm (Available)
Hot End
V3P (V3 hotend with PTFE version)
Max Nozzle Temperature
300 ºC
Connectivity
Wi-Fi, LAN, USB port, Live camera
Noise Emission (Acoustic)
<50 dB(A) when building
Operating Ambient Temperature
15-30 ºC, 10-90% RH non-condensing
Storage Temperature
-25 to 55℃, 10-90% RH non-condensing
Technical Certifications
CB, CE, FCC, RoHS, RCM
Filter
HEPA filter with activated charcoal
Net Weight
35 kg
Gross Weight (Carton Only)
41.3 kg
Gross Weight (Carton with Pallet)
50 kg
* The build volume of the E2 is not cuboid. For more details, please click here.
Power Supply Input
100-240 V AC, 50/60 Hz 230 V @2 A
Power Supply Output
24 V DC, 350 W
Slicing Software
ideaMaker
Supported File Types
STL/ OBJ/ 3MF
Supported OS
Windows/ macOS/ Linux
Machine Code Type
GCODE
7-inch Touch Screen
Wi-Fi, Ethernet
Firmware recording, no need for battery installation.
1024×600
Atmel ARM Cortex-M4 120MHz FPU
NXP ARM Cortex-A9 Quad 1 GHz
1GB
8GB
Embedded Linux
USB 2.0×2, Ethernet×1